Asia Circuits, Inc. Printed Circuit Boards - Capabilities

 

Layers 1-26
   
Panel Size (max.) 24" x 28"
   
Board Thickness .016" (6 layer) -.200"
   
Laminates/Materials FR4 Tg135 C, Tg170 C, Tg180 C
CEM (composite epoxy material)
Getek
Teflon
Ceramic
   
Min. Line & Space .003/.003" internal
   
Min. Drill Size .005" finish with mechanical drill
.005" finish with laser drill for blind via
   
Min. SMT Pad Pitch .016"
   
Aspect Ratio 10:1
   
Controlled Impedance TDR Certified
   
Blind & Buried Vias  
   
Min. Core Thickness .002"
   
Surface Finishes Immersion Gold, Silver, Tin
HASL, OSP, Carbon Ink
   
Heavy Solder Coating Corfin, Enhanced Solder
   
Heavy Copper 5oz
   


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