1. Gerber G274 pr G274X data for each manufacturing layer of the design (signal layers, power/ground layers, soldermask layers, silkscreen layers). Keypad layer for carbon ink must also be included if it is required.
   
   
2. An aperture list for the Gerber files if apertures are not embedded in the Gerber data.
   
   
3. A drill file with tool codes and X-Y coordinates of all holes in either ASCII or EIA format.
   
   
4. A fabrication drawing including:
   a. Board outline dimensions including cut-outs, chamfers, radii, bevels, scores, etc.
   b. Dimensions from a reference hole in the board to a corner of the board outline.
   c. A hole chart with the hole symbols on the drawing and the finished hole size distinguished with PTH or NPTH & its tolerance.
   d. Material requirements.
   e. Surface finish.
   f. Finished board thickness and tolerance.
   g. Layer stackup order (dielectric thickness & copper thickness of each layer).
   h. Controlled impedance requirements.
   i. SIR, SEC, etc. requirements.
   j. Carbon ink for keypad (if required) material, conductive resistance etc.
   k. Notes defining any other requirements or specifications pertinent to the design.
   l. The fabrication drawing may be in Gerber, HPGL, AutoCAD (DXF), PDF, or DXF format or hardcopy.
   m. A dimensioned drawing of the array if the design is to be shipped as a multiple-up array.

File Types Accepted

•  Genesis format from Valor (ODB++)
•  RS274X
•  Gerber 274D
•  Excellon 1 & 2
•  HPGL or HPGL 2
•  AutoCAD drawing or DXF
•  Drill datafile