| Process
|
Equipment |
| Current |
2004 |
2006 |
Remarks |
| Material |
|
Std
Fr4, Fr4 Tg 170 & 180 C,Getek, Teflon,Ceramic |
|
|
|
| Minimum
Core Thickness |
|
2
Mil |
|
|
|
| Maximum
Layer Count |
|
26 |
40 |
50 |
|
| Maximum
Production Panel |
|
24"x28" |
|
|
|
| Maximum
Finish Panel Size |
|
22"x26" |
26"x30" |
26"x32" |
|
| Maximum
Board Thickness |
Inner
Layer |
.080" |
|
|
|
| Finish |
.200" |
.40" |
.50" |
|
| Min.
Finish Board Thickness |
|
.016"
(6 Layers) |
|
|
|
| Board
Thickness Tolerance |
|
+/-
.005 (T<.062") +/- 10% (T>.062") |
|
|
|
| Min.
Line/Space |
Inner
Layer |
3/3
Mil |
|
2/2 |
|
| Outer
Layer |
4/4
Mil |
|
3/3 |
|
| Warp/Twist |
|
.0075"
Per Inch |
|
|
|
| Minimum
SMT Pitch |
|
.016" |
|
|
|
| Layer
to Layer Registration |
|
3
Mil |
|
|
|
| Controlled
Impedance |
|
+/-
10% |
+/-
5% |
|
|
| Minimum
Finish Hole Size |
Mechanical
Drill |
.005" |
|
|
|
| Laser
Drill |
.005" |
|
|
|
| Finish
Hole Size Tolerance |
P.T.H. |
+/-
.002" |
|
|
|
|
Non-PTH |
+/-
.001" |
|
|
|
| True
Hole Position |
|
+/-
.002" |
|
|
|
| Aspect
Ratio |
|
10:1 |
|
12:1 |
|
| Maximum
Gold Thickness Contact Fingers |
|
50µ" |
|
|
|
| Outline
Tolerance |
|
+/-
.005" |
|
|
|
| Surface
Plating Finish |
|
Hasl/Immersion
Au/Immersion Ag/Immersion Sn/ENTEK 106A OSP |
|
|
|
| Buried/Blind
Via |
|
Yes |
|
|
|
| Heavy
Copper |
|
5
Oz Copper UL Approved |
7
oz |
|
|
| Pulse
Plating |
|
Yes |
|
|
|
